Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854959 | Metal-insulator-metal device with improved performance | Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin, Kuan-Hua Lin | 2023-12-26 |
| 11791332 | Stacked semiconductor device and method | Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin | 2023-10-17 |
| 11764129 | Method of forming shield structure for backside through substrate vias (TSVS) | Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Wei-Tao Tsai | 2023-09-19 |
| 11756936 | Backside contact to improve thermal dissipation away from semiconductor devices | Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen +1 more | 2023-09-12 |
| 11756862 | Oversized via as through-substrate-via (TSV) stop layer | Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen | 2023-09-12 |
| 11756920 | Semiconductor structure and manufacturing method thereof | Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin, Zheng-Xun Li | 2023-09-12 |
| 11735617 | Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same | Sheng-Chau Chen, Cheng-Hsien Chou | 2023-08-22 |
| 11694997 | Backside contact for thermal displacement in a multi-wafer stacked integrated circuit | Ping-Tzu Chen, Hsing-Chih Lin | 2023-07-04 |