Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764129 | Method of forming shield structure for backside through substrate vias (TSVS) | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu | 2023-09-19 |
WT
Wei-Tao Tsai
Overall (2023): #209,778 of 537,848Top 40%
1
Patents 2023