Issued Patents 2023
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804473 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2023-10-31 |
| 11735624 | Multi-lateral recessed MIM structure | Alexander Kalnitsky, Ru-Liang Lee, Ming Chyi Liu, Sheng-Chan Li | 2023-08-22 |
| 11735617 | Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same | Cheng-Hsien Chou, Min-Feng Kao | 2023-08-22 |
| 11715674 | Trim wall protection method for multi-wafer stacking | Sheng-Chan Li, Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu | 2023-08-01 |
| 11705360 | Image sensor with dual trench isolation structure | Cheng-Hsien Chou, Tzu-Jui Wang, Sheng-Chan Li | 2023-07-18 |
| 11682652 | Notched wafer and bonding support structure to improve wafer stacking | Sheng-Chan Li, Cheng-Hsien Chou, Cheng-Yuan Tsai | 2023-06-20 |
| 11670539 | Method of making a semiconductor arrangement | Ming-Che Lee, Cheng-Hsien Chou, Cheng-Yuan Tsai | 2023-06-06 |
| 11664411 | Semiconductor structure having integrated inductor therein | Ming-Che Lee, I-Nan Chen, Cheng-Hsien Chou, Cheng-Yuan Tsai | 2023-05-30 |
| 11652124 | Isolation structure having an air gap to reduce pixel crosstalk | Tsung-Wei Huang, Chao-Ching Chang, Yun-Wei Cheng, Chih-Lung CHENG, Yen-Chang Chen +4 more | 2023-05-16 |
| 11605534 | Particle prevention in wafer edge trimming | Tung-He Chou, Ming-Tung Wu, Hsun-Chung Kuang | 2023-03-14 |
| 11594679 | Structure improving reliability of top electrode contact for resistance switching RAM having cells of varying height | Cheng-Tai Hsiao, Hsun-Chung Kuang | 2023-02-28 |
| 11587908 | 3DIC structure and methods of forming | Kuo-Ming Wu, Yung-Lung Lin, Zhi-Yang Wang, Cheng-Hsien Chou | 2023-02-21 |
| 11581254 | Three dimensional MIM capacitor having a comb structure and methods of making the same | Paul Yang, Tsun-Kai Tsao, Sheng-Chan Li, Cheng-Yuan Tsai | 2023-02-14 |
| 11552066 | Protective wafer grooving structure for wafer thinning and methods of using the same | Kuo-Ming Wu, Ming-Che Lee, Hau-Yi Hsiao, Cheng-Hsien Chou, Cheng-Yuan Tsai | 2023-01-10 |