Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842992 | Seal ring structures and methods of forming same | Kuo-Ming Wu, Kuan-Liang Liu, Wen-De Wang | 2023-12-12 |
| 11804473 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2023-10-31 |
| 11587908 | 3DIC structure and methods of forming | Kuo-Ming Wu, Zhi-Yang Wang, Sheng-Chau Chen, Cheng-Hsien Chou | 2023-02-21 |
| 11545395 | Techniques for wafer stack processing | Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Hau-Yi Hsiao | 2023-01-03 |