Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804473 | Hybrid bond pad structure | Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2023-10-31 |
| 11694979 | Isolation structure for bond pad structure | Jeng-Shyan Lin, Shih Pei Chou, Tzu-Hsuan Hsu | 2023-07-04 |