Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855159 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuo-Hwa Tzeng, Yu-Hung Cheng +1 more | 2023-12-26 |
| 11830764 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Yu-Hung Cheng +1 more | 2023-11-28 |
| 11776985 | Method of forming self aligned grids in BSI image sensor | Tsun-Kai Tsao, Jiech-Fun Lu, Wei Chuang Wu | 2023-10-03 |
| 11769778 | Method for forming light pipe structure with high quantum efficiency | Tsun-Kai Tsao, Jiech-Fun Lu, Tzu-Ming Wang | 2023-09-26 |
| 11694979 | Isolation structure for bond pad structure | Sin-Yao Huang, Jeng-Shyan Lin, Tzu-Hsuan Hsu | 2023-07-04 |