Issued Patents 2023
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856750 | Semiconductor arrangement with capacitor | Chern-Yow Hsu, Chen-Jong Wang, Shih-Chang Liu, Xiaomeng Chen | 2023-12-26 |
| 11855159 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Jiech-Fun Lu, Kuo-Hwa Tzeng, Shih Pei Chou, Yu-Hung Cheng +1 more | 2023-12-26 |
| 11854795 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh +2 more | 2023-12-26 |
| 11830764 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Jiech-Fun Lu, Kuan-Liang Liu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2023-11-28 |
| 11818944 | Deposition system for high accuracy patterning | Ping-Yin Liu, Xin-Hua Huang, Yu-Hsing Chang, Yeong-Jyh Lin | 2023-11-14 |
| 11804531 | Thin film transfer using substrate with etch stop layer and diffusion barrier layer | Eugene Chen, Ru-Liang Lee, Chen-Hao Chiang | 2023-10-31 |
| 11742262 | Integrated circuit having a resistor layer partially overlapping endcaps | Yuan-Tai Tseng, Chung-Yen Chou, Ming Chyi Liu | 2023-08-29 |
| 11721752 | Semiconductor device having doped seed layer and method of manufacturing the same | Chi-Ming Chen, Po-Chun Liu, Chung-Yi Yu, Ru-Liang Lee | 2023-08-08 |
| 11658224 | Split gate memory device and method of fabricating the same | Chang-Ming Wu, Wei-Cheng Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang | 2023-05-23 |
| 11637239 | High yield RRAM cell with optimized film scheme | Trinh Hai Dang, Hsing-Lien Lin, Cheng-Yuan Tsai, Chin-Chieh Yang, Yu-Wen Liao +1 more | 2023-04-25 |
| 11611005 | Backside illuminated photo-sensitive device with gradated buffer layer | Yu-Hung Cheng, Cheng-Ta Wu, Xiaomeng Chen, Yen-Chang Chu, Yeur-Luen Tu | 2023-03-21 |
| 11594413 | Semiconductor structure having sets of III-V compound layers and method of forming | Chi-Ming Chen, Po-Chun Liu, Chung-Yi Yu | 2023-02-28 |
| 11594593 | Method to reduce breakdown failure in a MIM capacitor | Hsing-Lien Lin, Chii-Ming Wu, Chung-Yi Yu, Rei-Lin Chu | 2023-02-28 |