Issued Patents 2023
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856750 | Semiconductor arrangement with capacitor | Chen-Jong Wang, Chia-Shiung Tsai, Shih-Chang Liu, Xiaomeng Chen | 2023-12-26 |
| 11855127 | Semiconductor structure and method for forming the same | Yi Jen Tsai, Yuan-Tai Tseng | 2023-12-26 |
| 11844285 | Magnetic tunnel junction memory cell with a buffer-layer and methods for forming the same | — | 2023-12-12 |
| 11839161 | Semiconductor structure | Shih-Chang Liu | 2023-12-05 |
| 11824022 | Bond pad with enhanced reliability | Tzu-Hsuan Yeh | 2023-11-21 |
| 11805660 | Semiconductor structure | Yuan-Tai Tseng, Shih-Chang Liu | 2023-10-31 |
| 11800822 | Memory device with composite spacer | Fu-Ting Sung, Shih-Chang Liu | 2023-10-24 |
| 11785861 | Semiconductor structure and method of manufacturing the same | Fu-Ting Sung, Chung-Chiang Min, Yuan-Tai Tseng, Shih-Chang Liu | 2023-10-10 |
| 11765980 | Method for forming a hard mask with a tapered profile | Min-Yung Ko, Chang-Ming Wu, Shih-Chang Liu | 2023-09-19 |
| 11735550 | Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion | Ching-Sheng Chu | 2023-08-22 |
| 11721683 | Mask transfer method (and related apparatus) for a bumping process | Ching-Sheng Chu | 2023-08-08 |
| 11683990 | Techniques for MRAM MTJ top electrode connection | Harry-Hak-Lay Chuang, Shih-Chang Liu | 2023-06-20 |
| 11575052 | Semiconductor device and method of forming the same | Yu-Hsing Chang, Shih-Chang Liu | 2023-02-07 |
| 11569296 | Semiconductor structure | Yuan-Tai Tseng, Shih-Chang Liu | 2023-01-31 |