TY

Tzu-Hsuan Yeh

TSMC: 1 patents #2,163 of 4,064Top 55%
Overall (2023): #218,852 of 537,848Top 45%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11824022 Bond pad with enhanced reliability Chern-Yow Hsu 2023-11-21