Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769791 | High capacitance MIM device with self aligned spacer | Dun-Nian Yaung, Yu-Cheng Tsai, Meng-Hsien Lin, Ching-Chung Su, Jen-Cheng Liu +2 more | 2023-09-26 |
| 11735550 | Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion | Chern-Yow Hsu | 2023-08-22 |
| 11721683 | Mask transfer method (and related apparatus) for a bumping process | Chern-Yow Hsu | 2023-08-08 |