Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855159 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2023-12-26 |
KT
Kuo-Hwa Tzeng
Overall (2023): #359,836 of 537,848Top 70%
1
Patents 2023