Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855159 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Chia-Shiung Tsai, Kuo-Hwa Tzeng, Shih Pei Chou, Yu-Hung Cheng +1 more | 2023-12-26 |
| 11830764 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Kuan-Liang Liu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2023-11-28 |
| 11776985 | Method of forming self aligned grids in BSI image sensor | Tsun-Kai Tsao, Shih Pei Chou, Wei Chuang Wu | 2023-10-03 |
| 11769778 | Method for forming light pipe structure with high quantum efficiency | Tsun-Kai Tsao, Shih Pei Chou, Tzu-Ming Wang | 2023-09-26 |
| 11756970 | Metal grid structure to improve image sensor performance | Ming Chyi Liu | 2023-09-12 |
| 11710783 | Bipolar junction transistor (BJT) comprising a multilayer base dielectric film | Chun-Tsung Kuo | 2023-07-25 |
| 11652025 | Through-substrate via formation to enlarge electrochemical plating window | Hung-Ling Shih, Ming Chyi Liu | 2023-05-16 |
| 11600647 | Absorption enhancement structure to increase quantum efficiency of image sensor | Tsun-Kai Tsao, Cheng-Hsien Chou | 2023-03-07 |