Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842992 | Seal ring structures and methods of forming same | Kuo-Ming Wu, Wen-De Wang, Yung-Lung Lin | 2023-12-12 |
| 11830764 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2023-11-28 |
| 11742321 | Apparatus for bond wave propagation control | Xin-Hua Huang, Kuo-Liang Lu, Ping-Yin Liu | 2023-08-29 |
| 11721587 | Transistor structure | Shih-Yin Hsiao, Ching-Chung Yang | 2023-08-08 |
| 11710656 | Method of forming semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu | 2023-07-25 |
| 11676969 | Semiconductor-on-insulator wafer having a composite insulator layer | Yeur-Luen Tu | 2023-06-13 |
| 11545443 | Method for forming hybrid-bonding structure | Kuo-Ming Wu, Pao-Tung Chen | 2023-01-03 |