Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854999 | Patterning a transparent wafer to form an alignment mark in the transparent wafer | Xin-Hua Huang | 2023-12-26 |
| 11854795 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2023-12-26 |
| 11818944 | Deposition system for high accuracy patterning | Chia-Shiung Tsai, Xin-Hua Huang, Yu-Hsing Chang, Yeong-Jyh Lin | 2023-11-14 |
| 11742321 | Apparatus for bond wave propagation control | Xin-Hua Huang, Kuan-Liang Liu, Kuo-Liang Lu | 2023-08-29 |
| 11721637 | Patterning a transparent wafer to form an alignment mark in the transparent wafer | Xin-Hua Huang | 2023-08-08 |
| 11621186 | Simultaneous bonding approach for high quality wafer stacking applications | Xin-Hua Huang, Chang-Chen Tsao | 2023-04-04 |
| 11550812 | Processing a federated query via data serialization | Lei Cui | 2023-01-10 |
| D974886 | Magnetic hook | — | 2023-01-10 |