Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854795 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh +2 more | 2023-12-26 |
| 11735635 | Semiconductor device and fabrication method thereof | Chun-Han Tsao, Chih-Ming Chen, Han-Yu Chen, Szu-Yu Wang, Cheng-Yuan Tsai | 2023-08-22 |