Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670524 | Fully automated wafer debonding system and method thereof | Cheng-Fei Yu, Ting-Yau Shiu, Cheng-Kang Hu, Hsu-Shui Liu, Jiun-Rong Pai | 2023-06-06 |
| 11621186 | Simultaneous bonding approach for high quality wafer stacking applications | Xin-Hua Huang, Ping-Yin Liu | 2023-04-04 |