Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670524 | Fully automated wafer debonding system and method thereof | Cheng-Fei Yu, Chang-Chen Tsao, Cheng-Kang Hu, Hsu-Shui Liu, Jiun-Rong Pai | 2023-06-06 |
TS
Ting-Yau Shiu
Overall (2023): #225,889 of 537,848Top 45%
1
Patents 2023