Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670524 | Fully automated wafer debonding system and method thereof | Chang-Chen Tsao, Ting-Yau Shiu, Cheng-Kang Hu, Hsu-Shui Liu, Jiun-Rong Pai | 2023-06-06 |
CY
Cheng-Fei Yu
Overall (2023): #482,024 of 537,848Top 90%
1
Patents 2023