Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11768484 | Semiconductor wafer cooling | Yung-Yao Lee, Jui-Chun Peng, Hsu-Shui Liu | 2023-09-26 |
| 11670524 | Fully automated wafer debonding system and method thereof | Cheng-Fei Yu, Chang-Chen Tsao, Ting-Yau Shiu, Hsu-Shui Liu, Jiun-Rong Pai | 2023-06-06 |
| 11651981 | Method and system for map-free inspection of semiconductor devices | Jiao-Rou Liao, Sheng-Hsiang Chuang, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo | 2023-05-16 |