Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11818944 | Deposition system for high accuracy patterning | Ping-Yin Liu, Chia-Shiung Tsai, Xin-Hua Huang, Yu-Hsing Chang | 2023-11-14 |
| 11688717 | Mechanical wafer alignment detection for bonding process | Ching-Hung Wang, Ching-I Li, Tzu Wei Yu, Chung-Yi Yu | 2023-06-27 |