Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688717 | Mechanical wafer alignment detection for bonding process | Yeong-Jyh Lin, Ching-I Li, Tzu Wei Yu, Chung-Yi Yu | 2023-06-27 |
| 11610842 | Memory device and method of manufacturing the same | Shih-Chin Lee, Chen-Yu Cheng, Tzung-Ting Han | 2023-03-21 |