Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817469 | Light absorbing layer to enhance P-type diffusion for DTI in image sensors | Yu-Hung Cheng, Yu Fang, Yu-Yao Hsia, Min-Ying Tsai | 2023-11-14 |
| 11784204 | Enhanced trench isolation structure | Min-Ying Tsai, Cheng-Te Lee, Rei-Lin Chu, Chung-Yi Yu | 2023-10-10 |
| 11721774 | Full well capacity for image sensor | Kai-Yun Yang, Chun-Yuan Chen | 2023-08-08 |
| 11688717 | Mechanical wafer alignment detection for bonding process | Ching-Hung Wang, Yeong-Jyh Lin, Tzu Wei Yu, Chung-Yi Yu | 2023-06-27 |
| 11682578 | Multilayer isolation structure for high voltage silicon-on-insulator device | Yu-Hung Cheng, Yu-Chun Chang, Ru-Liang Lee | 2023-06-20 |
| 11664425 | P-type field effect transistor and method for fabricating the same | Shi-You Liu, Tsai-Yu Wen, Ya-Yin Hsiao, Chih-Chiang Wu, Yu-Chun Liu +4 more | 2023-05-30 |