Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688717 | Mechanical wafer alignment detection for bonding process | Ching-Hung Wang, Yeong-Jyh Lin, Ching-I Li, Chung-Yi Yu | 2023-06-27 |
TY
Tzu Wei Yu
Overall (2023): #218,849 of 537,848Top 45%
1
Patents 2023