Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804531 | Thin film transfer using substrate with etch stop layer and diffusion barrier layer | Eugene Chen, Chia-Shiung Tsai, Chen-Hao Chiang | 2023-10-31 |
| 11735624 | Multi-lateral recessed MIM structure | Alexander Kalnitsky, Ming Chyi Liu, Sheng-Chan Li, Sheng-Chau Chen | 2023-08-22 |
| 11721752 | Semiconductor device having doped seed layer and method of manufacturing the same | Chi-Ming Chen, Po-Chun Liu, Chung-Yi Yu, Chia-Shiung Tsai | 2023-08-08 |
| 11682578 | Multilayer isolation structure for high voltage silicon-on-insulator device | Yu-Hung Cheng, Yu-Chun Chang, Ching-I Li | 2023-06-20 |