Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817470 | Stacked substrate structure with inter-tier interconnection | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2023-11-14 |
| 11769781 | Backside illuminated global shutter image sensor | Shu-Ting Tsai, Tzu-Hsuan Hsu | 2023-09-26 |
| 11694979 | Isolation structure for bond pad structure | Sin-Yao Huang, Shih Pei Chou, Tzu-Hsuan Hsu | 2023-07-04 |
| 11596800 | Interconnect structure and method of forming same | Shu-Ting Tsai, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2023-03-07 |