Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817470 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Yu-Yang Shen | 2023-11-14 |
WW
Wei-Chih Weng
Overall (2023): #209,623 of 537,848Top 40%
1
Patents 2023