Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817470 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Wei-Chih Weng | 2023-11-14 |
| 11646247 | Ion through-substrate via | Chien-Hsien Tseng, Dun-Nian Yaung, Nai-Wen Cheng, Pao-Tung Chen | 2023-05-09 |
| 11552027 | Semiconductor packaging device comprising a shield structure | Wei-Yu Chien, Chien-Hsien Tseng, Dun-Nian Yaung, Nai-Wen Cheng, Pao-Tung Chen +1 more | 2023-01-10 |