Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646247 | Ion through-substrate via | Yu-Yang Shen, Chien-Hsien Tseng, Dun-Nian Yaung, Pao-Tung Chen | 2023-05-09 |
| 11552027 | Semiconductor packaging device comprising a shield structure | Wei-Yu Chien, Chien-Hsien Tseng, Dun-Nian Yaung, Pao-Tung Chen, Yi-Shin Chu +1 more | 2023-01-10 |