Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798916 | 3DIC interconnect apparatus and method | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Chia-Chieh Lin, U-Ting Chen | 2023-10-24 |
| 11769781 | Backside illuminated global shutter image sensor | Jeng-Shyan Lin, Tzu-Hsuan Hsu | 2023-09-26 |
| 11596800 | Interconnect structure and method of forming same | Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2023-03-07 |