Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804473 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2023-10-31 |
| 11791357 | Composite BSI structure and method of manufacturing the same | Wei Chuang Wu, Dun-Nian Yaung, Jen-Cheng Liu, Jhy-Jyi Sze, Keng-Yu Chou +3 more | 2023-10-17 |
| 11791361 | Image sensor with overlap of backside trench isolation structure and vertical transfer gate | Dun-Nian Yaung, Jen-Cheng Liu, Wei Chuang Wu, Yen-Yu Chen, Chih-Kuan Yu | 2023-10-17 |
| 11596800 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu | 2023-03-07 |