Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804473 | Hybrid bond pad structure | Sin-Yao Huang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2023-10-31 |
| 11798916 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Chia-Chieh Lin, U-Ting Chen | 2023-10-24 |
| 11596800 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2023-03-07 |