Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11846871 | Device with a recessed gate electrode that has high thickness uniformity | Hung-Shu Huang, Ming Chyi Liu | 2023-12-19 |
| 11605534 | Particle prevention in wafer edge trimming | Sheng-Chau Chen, Ming-Tung Wu, Hsun-Chung Kuang | 2023-03-14 |