Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11846871 | Device with a recessed gate electrode that has high thickness uniformity | Ming Chyi Liu, Tung-He Chou | 2023-12-19 |
| 11574882 | Pad structure and manufacturing method thereof in semiconductor device | Ming Chyi Liu | 2023-02-07 |