Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710712 | Semiconductor device and manufacturing method of the same | Jhu-Min Song, Kong-Beng Thei, Alexander Kalnitsky, Hsiao-Chin Tuan | 2023-07-25 |
| 11705449 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Hsing-Chih Lin, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2023-07-18 |
| 11646308 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Hsing-Chih Lin, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2023-05-09 |
| 11569363 | Dishing prevention dummy structures for semiconductor devices | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Kong-Beng Thei, Yi-Sheng Chen +1 more | 2023-01-31 |