Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705449 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan +2 more | 2023-07-18 |
| 11646308 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan +2 more | 2023-05-09 |
| 11569363 | Dishing prevention dummy structures for semiconductor devices | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Fu-Jier Fan, Kong-Beng Thei +1 more | 2023-01-31 |