Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855091 | Boundary design for high-voltage integration on HKMG technology | Yi-Huan Chen, Alexander Kalnitsky, Kong-Beng Thei, Ming Chyi Liu, Shih-Chung Hsiao +1 more | 2023-12-26 |
| 11823959 | FUSI gated device formation | Yi-Huan Chen, Ta-Wei Lin, Hsiao-Chin Tuan, Alexander Kalnitsky, Kong-Beng Thei +1 more | 2023-11-21 |
| 11810973 | Semiconductor structure and method of forming thereof | Yi-Huan Chen, Szu-Hsien Liu, Kong-Beng Thei | 2023-11-07 |
| 11799007 | Thicker corner of a gate dielectric structure around a recessed gate electrode for an MV device | Yi-Huan Chen, Kong-Beng Thei, Alexander Kalnitsky, Szu-Hsien Liu, Huan-Chih Yuan | 2023-10-24 |
| 11677022 | Semiconductor structure and method of forming thereof | Yi-Huan Chen, Szu-Hsien Liu, Kong-Beng Thei, Huan-Chih Yuan, Jhu-Min Song | 2023-06-13 |
| 11569363 | Dishing prevention dummy structures for semiconductor devices | Yi-Huan Chen, Ta-Wei Lin, Fu-Jier Fan, Kong-Beng Thei, Yi-Sheng Chen +1 more | 2023-01-31 |