Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854800 | Device and method for high pressure anneal | Ya-Wen Chiu, Cheng-Po Chau, Yi Che Chan, Chih Ping Liao, YungHao Wang +1 more | 2023-12-26 |
| 11640986 | Implantation and annealing for semiconductor device | Yu-Chang Lin, Tien-Shun Chang, Chun-Feng Nieh, Sen-Hong Syue, Huicheng Chang | 2023-05-02 |
| 11605635 | Semiconductor device and method of forming same | Sen-Hong Syue, Li-Ting Wang, Huicheng Chang, Yee-Chia Yeo | 2023-03-14 |
| 11600653 | Methods and apparatus for via last through-vias | Pao-Tung Chen, Dun-Nian Yaung, Jen-Cheng Liu | 2023-03-07 |
| 11587910 | Stacked semiconductor structure and method | Meng-Hsun Wan, Dun-Nian Yaung | 2023-02-21 |