Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11825916 | Buffing system for footwear | Chun-Chieh Chen, Chia-Hung Lin, Hsien-Kuang Wu, Hung-Yu Wu | 2023-11-28 |
| 11819090 | Buffing system for footwear | Chun-Chieh Chen, Chia-Hung Lin, Hsien-Kuang Wu, Hung-Yu Wu | 2023-11-21 |
| 11776901 | Via landing on first and second barrier layers to reduce cleaning time of conductive structure | Te-Hsien Hsieh, Yu-Hsing Chang | 2023-10-03 |
| 11728374 | Semiconductor device including a capacitor | Hong-Yang CHEN, Tian Sheng Lin, Yi-Cheng Chiu, Hung-Chou Lin, Kuo-Ming Wu +1 more | 2023-08-15 |
| 11588028 | Shielding structure for ultra-high voltage semiconductor devices | Yi-Cheng Chiu, Tian Sheng Lin, Hung-Chou Lin, Chiu-Hua Chung | 2023-02-21 |
| 11553763 | Buffing system for footwear | Chun-Chieh Chen, Chia-Hung Lin, Hsien-Kuang Wu, Hung-Yu Wu | 2023-01-17 |