Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776901 | Via landing on first and second barrier layers to reduce cleaning time of conductive structure | Yu-Hsing Chang, Yi-Min Chen | 2023-10-03 |
| 11751406 | 3D RRAM cell structure for reducing forming and set voltages | Tzu-Yu Chen, Kuo-Chi Tu, Yuan-Tai Tseng | 2023-09-05 |
| 11690232 | High density memory devices with low cell leakage and methods for forming the same | Yuan-Tai Tseng | 2023-06-27 |