Issued Patents 2023
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855058 | Package structure and method of forming the same | Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng | 2023-12-26 |
| 11854835 | Heterogeneous bonding structure and method forming same | Chen-Shien Chen, Lung-Kai Mao, Ming-Da Cheng, Wen-Hsiung Lu | 2023-12-26 |
| 11848270 | Chip structure and method for forming the same | Hong-Seng Shue, Sheng-Han Tsai, Kuo-Chin Chang, Kuo-Ching Hsu | 2023-12-19 |
| 11842935 | Method for forming a reconstructed package substrate comprising substrates blocks | Chen-Shien Chen, Kuo-Ching Hsu, Wei-Hung Lin, Hui-Min Huang, Ming-Da Cheng | 2023-12-12 |
| 11824026 | Connector structure and method of forming same | Chen-Shien Chen, Sheng-Yu Wu, Chita Chuang | 2023-11-21 |
| 11812646 | Display device and manufacturing method thereof | Sheng-Yu Wu, Shang-Yun Tu, Ching-Hui Chen | 2023-11-07 |
| 11756731 | Programmable inductor | Chen-Hua Yu, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu | 2023-09-12 |
| 11742204 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin +3 more | 2023-08-29 |
| 11728217 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Chien-Hsun Lee, Jiun Yi Wu | 2023-08-15 |
| 11652086 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Tsung-Ding Wang, Chen-Hua Yu | 2023-05-16 |
| 11631621 | Semiconductor device structure with magnetic element | Mill-Jer Wang, Tang-Jung Chiu, Chi-Chang Lai, Chia-Heng Tsai, Weii LIAO | 2023-04-18 |
| 11594484 | Forming bonding structures by using template layer as templates | Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky, Ming-Che Ho +3 more | 2023-02-28 |
| 11569419 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Wen-Hsiung Lu, Cheng-Jen Lin, Chin Wei Kang +1 more | 2023-01-31 |