Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854835 | Heterogeneous bonding structure and method forming same | Mirng-Ji Lii, Chen-Shien Chen, Ming-Da Cheng, Wen-Hsiung Lu | 2023-12-26 |
| 11721579 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Chin Wei Kang, Yung-Han Chuang, Yung-Sheng Lin | 2023-08-08 |