Issued Patents 2023
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854927 | Semiconductor package and method of forming same | Ting-Chen Tseng, Sih-Hao Liao, Yu-Hsiang Hu | 2023-12-26 |
| 11855246 | Semiconductor device and method | Chen-Hua Yu, Keng-Han Lin, Hui-Jung Tsai | 2023-12-26 |
| 11855014 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Yi-Wen Wu, Tzung-Hui Lee | 2023-12-26 |
| 11854997 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu | 2023-12-26 |
| 11841618 | Photoresist system and method | De-Yuan Lu, Chen-Hua Yu, Ming-Tan Lee | 2023-12-12 |
| 11842955 | Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure | Chen-Hua Yu, Ming-Che Ho, Tzung-Hui Lee | 2023-12-12 |
| 11842902 | Semiconductor package with alignment mark and manufacturing method thereof | Po-Han Wang, Yu-Hsiang Hu | 2023-12-12 |
| 11842896 | Semiconductor devices and methods of manufacturing | Hsing-Chieh Lee, Ming-Tan Lee | 2023-12-12 |
| 11837502 | Semiconductor package and methods of forming the same | Meng-Che Tu, Wei-Chih Chen, Sih-Hao Liao, Yu-Hsiang Hu, Chen-Hua Yu | 2023-12-05 |
| 11823969 | Packages with enlarged through-vias in encapsulant | Tai-Min Chang, Hui-Jung Tsai, De-Yuan Lu, Ming-Tan Lee | 2023-11-21 |
| 11823981 | Semiconductor package and manufacturing method thereof | Wei-Chung Chang, Ming-Che Ho | 2023-11-21 |
| 11823936 | Alignment holder and testing apparatus | Chih-Yu Wang, Hui-Jung Tsai | 2023-11-21 |
| 11817352 | Method of fabricating redistribution circuit structure | Po-Han Wang, Yu-Hsiang Hu | 2023-11-14 |
| 11817399 | Semiconductor device | Zi-Jheng Liu, Jo-Lin Lan, Yu-Hsiang Hu | 2023-11-14 |
| 11798893 | Semiconductor package and manufacturing method thereof | Yung-Chi Chu, Jhih-Yu Wang, Yu-Hsiang Hu | 2023-10-24 |
| 11798857 | Composition for sacrificial film, package, manufacturing method of package | Yung-Chi Chu, Yu-Hsiang Hu, Sih-Hao Liao | 2023-10-24 |
| 11789366 | Method for removing resist layer, and method of manufacturing semiconductor | Hui-Jung Tsai, Tai-Min Chang | 2023-10-17 |
| 11791313 | Semiconductor package and method of forming the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao, Hung-Chun Cho | 2023-10-17 |
| 11764124 | Sensing component encapsulated by an encapsulant with a roughness surface having a hollow region | Yung-Chi Chu, Yu-Hsiang Hu, Sih-Hao Liao, Tian Hu | 2023-09-19 |
| 11756929 | Semiconductor packages | Zi-Jheng Liu, Chen-Cheng Kuo | 2023-09-12 |
| 11756879 | Semiconductor devices and methods of manufacturing the same | Hui-Jung Tsai, Keng-Han Lin, Jyun-Siang Peng | 2023-09-12 |
| 11742317 | Process including a re-etching process for forming a semiconductor structure | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei +1 more | 2023-08-29 |
| 11728181 | Semiconductor device and method | Sih-Hao Liao, Yu-Hsiang Hu, Chen-Hua Yu | 2023-08-15 |
| 11721635 | Chip package and method of forming the same | Yu-Hsiang Hu, Chen-Hua Yu | 2023-08-08 |
| 11721603 | Integrated fan out method utilizing a filler-free insulating material | Wei-Chih Chen, Sih-Hao Liao, Yu-Hsiang Hu | 2023-08-08 |