Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742317 | Process including a re-etching process for forming a semiconductor structure | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Hung-Jui Kuo +1 more | 2023-08-29 |
| 11587902 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Hung-Jui Kuo +1 more | 2023-02-21 |
| 11569183 | Package structure and method of fabricating the same | Cheng-Yu Kuo, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Wei Huang | 2023-01-31 |