Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742317 | Process including a re-etching process for forming a semiconductor structure | Hui-Jung Tsai, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-08-29 |
| 11651994 | Processes for reducing leakage and improving adhesion | Hui-Jung Tsai, Hung-Jui Kuo, Chen-Hua Yu | 2023-05-16 |
| 11600574 | Method of forming RDLS and structure formed thereof | Hung-Jui Kuo, Hui-Jung Tsai, Chen-Hua Yu | 2023-03-07 |
| 11587902 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-02-21 |