Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756879 | Semiconductor devices and methods of manufacturing the same | Hung-Jui Kuo, Hui-Jung Tsai, Keng-Han Lin | 2023-09-12 |
| 11742317 | Process including a re-etching process for forming a semiconductor structure | Hui-Jung Tsai, Yun Chen Hsieh, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-08-29 |
| 11670582 | Package structure and method of fabricating the same | Hung-Jui Kuo, Hui-Jung Tsai | 2023-06-06 |
| 11587902 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-02-21 |
| 11557561 | Package structure and method of fabricating the same | Hui-Jung Tsai, Hung-Jui Kuo | 2023-01-17 |