Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848233 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo +1 more | 2023-12-19 |
| 11823969 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Hui-Jung Tsai, De-Yuan Lu, Ming-Tan Lee | 2023-11-21 |
| 11789366 | Method for removing resist layer, and method of manufacturing semiconductor | Hung-Jui Kuo, Hui-Jung Tsai | 2023-10-17 |
| 11742317 | Process including a re-etching process for forming a semiconductor structure | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-08-29 |
| 11587902 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-02-21 |