Issued Patents 2023
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855246 | Semiconductor device and method | Chen-Hua Yu, Keng-Han Lin, Hung-Jui Kuo | 2023-12-26 |
| 11823969 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Tai-Min Chang, De-Yuan Lu, Ming-Tan Lee | 2023-11-21 |
| 11823936 | Alignment holder and testing apparatus | Chih-Yu Wang, Hung-Jui Kuo | 2023-11-21 |
| 11789366 | Method for removing resist layer, and method of manufacturing semiconductor | Hung-Jui Kuo, Tai-Min Chang | 2023-10-17 |
| 11756879 | Semiconductor devices and methods of manufacturing the same | Hung-Jui Kuo, Keng-Han Lin, Jyun-Siang Peng | 2023-09-12 |
| 11742317 | Process including a re-etching process for forming a semiconductor structure | Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-08-29 |
| 11670582 | Package structure and method of fabricating the same | Hung-Jui Kuo, Jyun-Siang Peng | 2023-06-06 |
| 11664325 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2023-05-30 |
| 11651994 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hung-Jui Kuo, Chen-Hua Yu | 2023-05-16 |
| 11646281 | Semiconductor structures | Chen-Hua Yu, Hung-Jui Kuo, Tsao-Lun Chang | 2023-05-09 |
| 11600574 | Method of forming RDLS and structure formed thereof | Hung-Jui Kuo, Yun Chen Hsieh, Chen-Hua Yu | 2023-03-07 |
| 11587902 | Semiconductor structure and method of forming the same | Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-02-21 |
| 11557561 | Package structure and method of fabricating the same | Hung-Jui Kuo, Jyun-Siang Peng | 2023-01-17 |