Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569183 | Package structure and method of fabricating the same | Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Yi-Yang Lei, Wei Huang | 2023-01-31 |
CK
Cheng-Yu Kuo
Overall (2023): #488,813 of 537,848Top 95%
1
Patents 2023