Issued Patents 2023
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715717 | Methods of forming integrated circuit packages having adhesion layers over through vias | Hung-Chun Cho, Sih-Hao Liao, Yu-Hsiang Hu | 2023-08-01 |
| 11699598 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2023-07-11 |
| 11694967 | Package structure and method of fabricating the same | Jhih-Yu Wang, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu | 2023-07-04 |
| 11682636 | Info structure and method forming same | Po-Han Wang, Yu-Hsiang Hu, Chen-Hua Yu | 2023-06-20 |
| 11682647 | Semiconductor package and method for manufacturing the same | Po-Han Wang, Shih-Peng Tai, Yu-Hsiang Hu, I-Chia Chen | 2023-06-20 |
| 11670519 | Redistribution structures for semiconductor packages and methods of forming the same | Yu-Hsiang Hu, Chen-Hua Yu | 2023-06-06 |
| 11670582 | Package structure and method of fabricating the same | Hui-Jung Tsai, Jyun-Siang Peng | 2023-06-06 |
| 11670541 | Methods of manufacturing semiconductor device using phase shift mask | Chun-Chieh Wang, Jaw-Jung Shin, Ming-Tan Lee | 2023-06-06 |
| 11664323 | Semiconductor package and method | Po-Han Wang, Yu-Hsiang Hu | 2023-05-30 |
| 11658105 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Ching-Feng Yang, Kai-Chiang Wu, Ming-Che Ho | 2023-05-23 |
| 11651994 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hui-Jung Tsai, Chen-Hua Yu | 2023-05-16 |
| 11646281 | Semiconductor structures | Chen-Hua Yu, Hui-Jung Tsai, Tsao-Lun Chang | 2023-05-09 |
| 11646220 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2023-05-09 |
| 11605607 | Semiconductor device and methods of manufacture | Hung-Chun Cho, Yu-Hsiang Hu, Sih-Hao Liao | 2023-03-14 |
| 11605601 | Semiconductor package and method of forming the same | Ching-Wen Chen, Ming-Che Ho | 2023-03-14 |
| 11600592 | Package | Tian Hu, Yu-Hsiang Hu, Sih-Hao Liao | 2023-03-07 |
| 11600574 | Method of forming RDLS and structure formed thereof | Yun Chen Hsieh, Hui-Jung Tsai, Chen-Hua Yu | 2023-03-07 |
| 11594484 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Alexander Kalnitsky, Ming-Che Ho +3 more | 2023-02-28 |
| 11594472 | Package structure and method of forming the same | Hung-Chun Cho, Yu-Hsiang Hu, Sih-Hao Liao, Wei-Chih Chen | 2023-02-28 |
| 11587902 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei +1 more | 2023-02-21 |
| 11587818 | Chuck design and method for wafer | Chen-Hua Yu, Ming-Tan Lee | 2023-02-21 |
| 11557561 | Package structure and method of fabricating the same | Hui-Jung Tsai, Jyun-Siang Peng | 2023-01-17 |
| 11545457 | Semiconductor package, redistribution structure and method for forming the same | Chiang-Hao Lee, Ming-Che Ho | 2023-01-03 |