Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791313 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2023-10-17 |
| 11715717 | Methods of forming integrated circuit packages having adhesion layers over through vias | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-08-01 |
| 11605607 | Semiconductor device and methods of manufacture | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2023-03-14 |
| 11594472 | Package structure and method of forming the same | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Wei-Chih Chen | 2023-02-28 |